We employ a total staff of approximately 1,600, of whom approximately 49% are based in Europe and North America and 51% are based in Asia.īesi was incorporated under the laws of the Netherlands in May 1995 and had an initial public offering in December 1995. We operate facilities for production and development activities as well as sales and service offices across Europe, Asia and North America. We are a global company with headquarters in Duiven, the Netherlands. Our equipment performs critical functions in our customers' assembly operations and in many cases represents a significant percentage of their installed base of assembly equipment. Any other info or pics available upon request. besi-datacon-2200-evo-plus.png Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.
It’s in great condition and is always hooked up when being used. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Customers are principally independent device manufacturers (IDMs) who purchase our equipment for internal use at their assembly facilities and subcontractors who purchase our equipment to produce packages for third parties on a contract basis. Up for sale is a Dell G7 gaming laptop with the following specs: Intel Core i7 8750H Nvidia GeForce GTX 1060 with Max-Q 16GB RAM 1TB storage - One 500gb SSD and a 500gb m2 SSD. we have requirement for products like yours. Our customers are primarily leading multinational chip manufacturers, assembly subcontractors and electronics and industrial. want to sell your used datacon / besi 2200 evo+ institute for applied life sciences. (Besi) is engaged in one line of business, the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes.BE Semiconductor Industries N.V. More info on: FINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications. 3 systems available for sale Options 1 2 3. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. 00 2,200.00 2,200. Using 46 technology platforms, our integrated team of scientists and researchers works with. FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform. 3M is a global science company that never stops inventing.
More info on: ESEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.
DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
DATACON 2200 EVO DATACON 2200 EVO MANUAL MANUEL FOR BESI DATACON EVO. Dyno and Drag Strip measure horsepower (manual transmission only) and acceleration. Please contact us for the availability of the used semiconductor equipment. Discover all the information about the product Flip-chip die bonder Datacon 2200 evo - BE Semiconductor Industries and find where you can buy it. Datacon 2200 evoplus Innovative Solution for Innovative Products The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of.